Celsia NanoSpreaders™ were developed with one simple goal in mind: to cool today's silicon chips, LEDs, LCDs, and other electronic components better than any other technology in its price band. This goal is realised through a patented copper encased two-phase vapour chamber that is ultra thin (from 1.5mm) and light and delivers up to 30% lower thermal resistance (better cooling) than heat pipes when used as part of a total cooling solution. Click here to find out more about Celsia’s NanoSpreader™ technology.

NanoSpreaders™ can be attached directly to single or multiple heat sources, simplifying cooling solution design, and are an excellent means of transporting heat over a long distance. They can be easily shaped and integrated with complementary cooling components such as fins and fans and can even be affixed to an enclosure wall to maximize heat dissipating surface area.

Features & Benefits:

• As part of a complete cooling solution, NanoSpreaders™ reduce thermal resistance, allowing cooling efficiency gains of up to 30% over heat pipes
• Flat & ultra thin for space constrained environments (starting at only 1.5mm thick)
• Very large heat dissipating surface area for superior performance within an overall cooling solution (up to 70mm wide and 500mm height)
• Uniform heat spreading minimises hot spots from high heat flux devices
• Design versatility
    * can be mounted directly onto the heat source (eliminating a base plate)
    * easily integrates with complementary cooling components (fins or fans)
    * bendable (both horizontally and vertically)
• No moving parts or pumps - zero noise and no power consumption

Design Options:

Celsia NanoSpreaders™ can be can be used in a wide range of design configurations.

• Shaped or Flat Stand-Alone Thermal Solution: NanoSpreaders™ can be formed into virtually any shape and because they are flat, attaching them directly to the heat source and chassis wall lets them act as a stand-alone thermal solution.
• Part of an Extruded Solution: NanoSpreaders™ can be attached directly to an aluminium or copper extrusion or be integrated into its body.
• Used with Folded or Stamped Fins: One very unique feature of the Celsia NanoSpreader™ technology is the ability to efficiently move heat from one heat source to multiple areas, or to utilize ultra thin fins that minimize airflow restrictions and transfer heat to those fins from multiple heat sources or sides.
• Part of a Forced Convection Solution: High performance thermal solutions can benefit from NanoSpreaders™ ability to be used as part of a forced convection system.

Download the Celsia NanoSpreader™ product information PDF, view their Engineering FAQs or contact us for further information.