Celsia Technologies | Solutions by Industry

The majority of Celsia’s solutions have been designed for telecommunications, LED lighting and computer hardware applications but they have also worked with customers in industries as varied as military electronics and solar energy.

These are just a few examples of industry specific solutions along with their associated performance metrics:

Computer Hardware

The Nanospreader™ CPU cooling solution resulted with a T-case temperature of 58.5°C.  The existing 6mm, 4-heat pipe solution resulted with a T-case temperature of 67.8°C. Application: Cooling for an embedded processor.

Constraints: Very limited height restriction of 12mm.

Solution: A 2mm thick NanoSpreader™ is incorporated with a copper mounting block and aluminium fins. This configuration maximises the available fin area and airflow.

Test Conditions: Power - 50 Watts; Air Flow- 6 m/s

Results: The NanoSpreader™ CPU cooling solution resulted with a T-case temperature of 58.5°C. The existing 6mm, 4-heat pipe solution resulted with a T-case temperature of 67.8°C. Although both solutions use a base plate, NanoSpreader™ still posted a 14% performance gain over heat pipes.

LED Lighting

The NanoSpreader™ solution showed a 6 degree lower temperature (21% improvement) than the competitive heat pipe solution Application:LED lighting.

Constraints:18 watt heat load from an LED light source needed to be moved to a remote location.

Solution: By direct mounting the LED package onto a NanoSpreader™ and incorporating a small fan sink.

Results: The NanoSpreader™ solution showed a 6 degree lower temperature (21% improvement) than the competitive heat pipe solution.

Telecommunications

The 9 degree temperature improvement from the NanoSpreader™ solution allowed designers to choose between lower component temperatures or higher output from the devices. Application: Cooling for two TO-227 high power resistors.

Constraints: Minimum Airflow, small device size constrained airflow.

Solution: This solution required a large heatsink optimised towards a natural convection solution to be implemented since the available airflow was close to natural convection. The optimised solution was to embed a NanoSpreader™ under each resistor. This design allowed direct contact of the heat generating device with the NanoSpreader™ allowing the heat to be efficiently conducted to the far ends of the heatsink.

Test Conditions: Power – 200 Watts Per Device; Air Flow- 0.5 m/s

Results: The Maximum Case temperature of the Resistors using the NanoSpreader™ cooling was 78.4°C. The existing 6mm, 2-heatpipe per resistor solution for each resistor, resulted with a Maximum T-case temperature of 87.2°C. The 9 degree temperature improvement from the NanoSpreader™ solution allowed designers to choose between lower component temperatures or higher output from the devices.

Download the Celsia NanoSpreader™ product information PDF, view their Engineering FAQs or contact us for further information.