eGRAF® thermal solutions offer a unique combination of flexibility, weight savings and performance improvement to the electronic thermal management industry. With a diverse, award-winning portfolio of active and passive thermal solutions, eGRAF products have pioneered natural graphite technology for thermal management. By providing excellent thermal conductivity at a fraction of the weight, every eGRAF solution is designed to challenge and expand the constraints of today's thermal design capabilities. eGRAF products can effectively address your everyday design challenges. AET’s highly skilled team of thermal engineers offers an unrivalled expertise in creative thermal solutions.

An incredibly versatile material, natural graphite products are offered in a variety of forms and thermal conductivities, all of which can be engineered and custom-designed to meet specific application needs.

• Graphite's anisotropic properties allow it to move heat directionally making it possible to control the transfer of heat. These unique materials have an in-plane two-dimensional thermal conductivity that can be tailored to up to 500 W/mK and a through thickness third dimension conductivity in the 6-10 W/mK range. Other materials, such as aluminium and copper, move heat in all directions, but due to high contact resistance, they do not transfer heat from components efficiently.
• Graphite can be easily cut and moulded into intricate shapes, sizes and thickness. GrafTech AET products are available in rolls, sheets, with adhesive backing or as pre-cut, customised pieces. In addition, graphite can be combined with plastics, metals or elastomers in finished components.

SPREADERSHIELD™ 2-D Heat Spreaders

Improve performance, reduce weight, improve design flexibility

Made from natural graphite, SPREADERSHIELD™ products distribute heat evenly while providing thermal insulation through the thickness. Their unique combination of spreading and shielding properties make natural graphite an excellent material choice for thermal solutions. SPREADERSHIELD products are offered in a variety of engineered in-plane thermal conductivities, from 300-500 W/m-K. By eliminating heavy thermal solutions, SPREADERSHIELD products have enabled slimmer product design and reduced product weights by up to 50%.

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SPREADERSHIELD™ 3-D Heat Spreaders

Advanced materials = Advanced designs

SPREADERSHIELD™ 3-D technology maintains the same features as SPREADERSHIELD™ 2-D products, with two additional benefits: the ability to maintain form factor and accommodate specific shapes. Made from natural graphite laminated with Aluminium foil, SPREADERSHIELD™ 3D designs enable the creation of complex three-dimensional forms.

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HITHERM™ Thermal Interface Material

Excellent performance and flexibility for advanced designs

eGRAF® HITHERM™ 700 and 1200 SERIES are designed for use in applications requiring low contact resistance and high thermal conductivity at low clamping loads. eGRAF® HITHERM™ 2500 SERIES materials are formulated for use with today's high power components, which require minimal thermal resistance for maximum heat transfer efficiency. 2500 SERIES materials are manufactured from natural graphite and a polymer additive.

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zSPREADER™ Passive Heat Spreader

Optimal spreader for discrete heat source cooling

eGRAF® zSPREADER™ thermal management products are designed to provide minimal thermal resistance for optimal cooling of discrete heat sources. zSPREADER products combine a sheet of high-performance 500W/mK SPREADERSHIELD™ material with a copper or aluminium thermal via. Applications include high power LEDs, CPUs, GPUs, solid state relays, and ASICs, where key operating temperatures have been reduced by as much as 46°C! As a cost-effective alternative to Metal Core Printed Circuit Boards (MCPCBs), zSPREADER designs are also effective in applications that include LED Backlight Units, LED General Lighting, Automotive Electronics and Power Amplifiers.

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HS-400 & SS-500 Fin-Stock Materials

Superior performance at 40% of the weight

Bonded Fin Heat Sink & HS-400 & SS-500 Fin-Stock Materials provide an alternative to thermal engineers when aluminium can no longer meet power dissipation requirements and copper is too heavy. Custom designed to meet the thermal and mechanical demands of each application, HS-400 and SS-500 (developmental product) Fin-Stock materials offer improved performance at a fraction of the weight.

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HR-400 Heat Risers

A simple solution

eGRAF® HR-400 Heat Riser components are ideal for confined heat sources or ruggedized, sealed systems. Made from natural graphite, heat riser is mounted between the chip and heat sink to improve the heat flow from sensitive components to external casing.

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For further information about Graftech AET's eGRAF products or to request samples please contact us.