Product of the Month - December 2007

High Power Heat Sinks Offering Superior Performance at a Reduced Weight from GrafTech

High Power Heat Sinks

Very High Thermal Conductivity

Fins made from eGraf HS-400, a composite of natural graphite and epoxy resin, have a thermal conductivity which exceeds 370 W/m•K, and match that of copper. The aluminum alloy 6061 or 6063 commonly used extruded heat sinks, have thermal conductivities of only 166 to 201 W/m•K respectively.

Light Weight

HS-400 offers significant weight savings coming in at 1/5th the weight of copper and 3/4th the weight of aluminum. This alleviates the need for complex and costly retention mechanisms and helps improve shock & vibration performance.

Heat Sink Optimisation

HS-400 heat sinks are custom designed to meet the thermal and mechanical performance specification required in each application. Computational Fluid Dynamics (CFD)software is used to optimise the fin thickness, spacing, and base plate shape and size.

Heat Sink Base

Due to the mechanical stress placed on high power heat sinks, the heat sink base is typically made from aluminum or copper alloys, depending on the required thermal performance.

Heat Sink Shroud

To protect HS-400 fins, an aluminum shroud is typically attached to the base plate. This shroud ducts the air through the fins and can be used to attach a fan to the heat sink.

eGraf HS-400 Corrosion Resistance

eGraf HS-400, a natural graphite – epoxy composite is inert and will not corrode in most common environments.

Fin To Base Attachment

eGraf HS-400 fins are bonded to the base with a high thermal conductivity epoxy, similar to that used with conventional aluminum bonded fin heat sinks. Bonding techniques developed by GrafTech International Ltd., allow eGraf heat sinks to have the required thermal performance and mechanical reliability and to be cost effective.

Typical Applications

  • Servers
  • Raid Controllers
  • Power Electronics
  • Peltier Devices
  • IGBT Modules
  • RF Transistors
  • Diode & Thyristors Modules

Thermal Interface Material

To assure a good thermal contact between the device and the heat sink, a graphite thermal interface such as eGraf 1200 or eGraf HiTherm™ is recommended. eGraf thermal interface solutions can be pre attached to the heat sink.

Please contact us for further information

Download High Power Heat Sinks as a PDF.

Product of the month ~ Archive