Zarlink Semiconductor is a global company established for over 30 years. Their Advanced Packaging Division, which has been operating in South Wales for over 20 years, delivers a competitve advantage for its customers by miniaturising electronic components to create smaller, smarter and more reliable circuit solutions with a board footprint significantly smaller than individual ICs.

With a track record of success in designing and developing Advanced Packaging modules, their micro-packing expertise is at the heart of mission-critical and cutting-edge medical, telecom, industrial, aerospace and military applications.

Their experience includes:

• Key technology in ultra-reliable applications, such as pacemakers, defibrillators and hearing aids
• Designing and assembling a module for the world’s smallest pacemaker
• Developing patented in-body antenna technology for medical products
• Designing world’s smallest network timing module for Stratum 3 applications
• Developing “circuit on steel” packaging technology that halves the footprint of motor drive controllers and enhances reliability
• Developing and manufacturing low-cost microwave splitter components.

Zarlink has experience and expertise in all major packaging technologies.

Zarlink Advanced Packaging employs over 40 engineers supported by the latest hardware and software design tools to provide one of the most experienced Advanced Packaging design facilities in Europe. This integrated research, design and manufacturing facility is supported with onsite business services, sales and project management capabilities for seamless customer service delivery.

Zarlink Advanced Packaging is also actively involved in a number of collaborative research and development projects including the UK government funded SIMM (Self-Energising Implantable Medical Micro System) Project and the EU funded SHIFT (Smart High-Integration Flex Technologies) Project and the European Health Aims project.

Find out more about Zarlink’s expertise, technologies and capabilities or contact us for further information.